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Peter Wolters Surface Technologies GmbH & Co. KG


Peter Wolters Surface Technologies has been a global leading edge supplier to the semiconductor industry for more than four decades.

Within a short time Peter Wolters has become the No. 1 CMP supplier in the European semiconductor market. Furthermore, Peter Wolters has successfully taken market share against much larger competitors and now ranks 3rd on the list of 300 mm CMP suppliers.

 



Polishing head of the PM300 Apollo for 300 mm wafers

Peter Wolters is dedicated to developing and building turn-key CMP- (Chemical-Mechanical Polishing) tools enabling polishing technology for devices with structures below 100nm.

The PM 200 Gemini for 4 inch to 8 inch wafers and the PM 300 Apollo as well as the new HT-Cube 300 for 12 inch wafers are fully automated, designed with rigidity and reliability in mind.

 

Highest capacity in the various processes meets all requirements including multiple step processes up to three steps.

 

Peter Wolters Surface Technologies is the company with the longest production experience in CMP of 300 mm wafers. Ongoing development activities ensure a continuous competitive edge.

 

In the development of the CMP process, the company cooperates successfully with Fraunhofer ISIT. Supported by third-party funding and the ISIT competency, this is a best practice cooperation example of technology transfer made in Itzehoe.

 

The company now operates under Peter Wolters - A Novellus Systems Company. The US enterprise Novellus is one of the leading producers for finishings in the semiconductor industry.

 




Last Update: 26.12.2009

© Gesellschaft für Technologieförderung Itzehoe mbH



CMP Clustertool PM200 Gemini, used in the production of 150 mm and 200 mm wafers

Contact:

Peter Wolters Surface Technologies GmbH & Co. KG
Fraunhoferstraße 1
25524 Itzehoe, Germany
Tel: +49-4821-17 43 03
Fax: +49-4821-17 42 50
www.peter-wolters.com

CMP Chemical-Mechanical Polishing

In the semiconductor industry, CMP Chemical-Mechanical Polishing is the preferred process for high precision surface planarisation.

Planarity is the prerequisite in particular for handling lithography processes in the production of modern integrated circuits (IC).

In effect, progressive components with eight or more metal layers can be produced only with the help of CMP.

Chemical-Mechanical Polishing combines mechanical removal with polishing grains smaller than 100 nm in diameter and an etching removal through appropriate chemicals. The achieved surface roughness is in the Angström range.